我的購物車0
購物車中還沒有商品,趕快選購吧!
首頁 > TDK代理商 > CGB4B1X7R1A225M055AC
CGB4B1X7R1A225M055AC
影像僅供參考,以產品規格為準

CGB4B1X7R1A225M055AC

型號描述:
多層陶瓷電容器MLCC - SMD/SMT RECOMMENDED ALT 810-CGB4B1X7R1A225KC
型號:
CGB4B1X7R1A225M055AC
品牌:
TDK
交期:
5-8工作天
原廠包裝量:
4000
1+NT$11.6025
10+NT$7.9511
100+NT$4.5045
500+NT$3.1736
1000+NT$2.7983
4000+NT$2.457
8000+NT$2.1158
起訂量:1倍增量:1
價格:NT$11.6025數量:

合計:NT$12

Series
CGB
Packaging
Tape & Reel (TR)
Part Status
Not For New Designs
Capacitance
2.2µF
Tolerance
±20%
Voltage - Rated
10V
Temperature Coefficient
X7R
Operating Temperature
-55°C ~ 125°C
Features
Low Profile
Ratings
-
Applications
General Purpose
Failure Rate
-
Mounting Type
Surface Mount, MLCC
Package / Case
0805 (2012 Metric)
Size / Dimension
0.079" L x 0.049" W (2.00mm x 1.25mm)
Height - Seated (Max)
-
Thickness (Max)
0.022" (0.55mm)
Lead Spacing
-
Lead Style
-
  • 精選品牌
    • Samsung
    • ADI
    • Murata11
    • Amphenol
    • Roving
    • Walsin
    • Panasonic
    • TE
    • United-Chemi-Con
    • Molex
    • Nichicon
    • Microchip
    • Bourns
    • ROHM
    • AVX
    • Catalyst
    • ST
    • NXP
    • Vishay
    • KEMET
    • TDK
    • FTDI
    • HARTING
    • Mean Well
    • BroadcomLimited
    • Eaton
    • Microsemi
    • Atmel
    • JST
    • Agilent
      • 資訊中心