XC3S250E-5TQG144C
- 型號描述:
- FPGA - 現場可編程輯閘陣列 XC3S250E-5TQG144C
- 型號:
- XC3S250E-5TQG144C
- 品牌:
- Xilinx
- 交期:
- 5-8工作天
- 原廠包裝量:
- 1
- Series
- Spartan®-3E
- Packaging
- Tray
- Part Status
- Active
- Number of LABs/CLBs
- 612
- Number of Logic Elements/Cells
- 5508
- Total RAM Bits
- 221184
- Number of I/O
- 108
- Number of Gates
- 250000
- Voltage - Supply
- 1.14V ~ 1.26V
- Mounting Type
- Surface Mount
- Operating Temperature
- 0°C ~ 85°C (TJ)
- Package / Case
- 144-LQFP
- Supplier Device Package
- 144-TQFP (20x20)
- Base Part Number
- XC3S250
- 精選品牌
- 熱銷產品
- MAX25222CATJ/V+
- MAX25220ATJ/V+
- TLV9041IDBVR
- WP26DK-P040VA3-R15000
- PPM-2-5525-SG-WT
- R2016-40.000-10-F-1010-EXT-TR-NS1
- PIC16F17146-I/P
- IL-G-12P-S3L2-SA
- LT1211CS8#PBF
- TZX5V1A-TR
- 3365/50 300
- SR731JTTDR365F
- WR06W2R20FTL
- MAX3221EEUE+
- TPS2557DRBT
- MP173AGS-Z
- DDZ12C-7
- RC0402DR-07240RL
- B66305G0000X187
- OD3510-05MB
- E-701
- AD7880BN
- EGG.2B.665.ZZM
- PA2512FKF7W7U5E
- RT0603FRE07147RL
- MS27473E12F4S
- MEASP105CC6226MF1A01
- 20374-R30E-31
- 20374-R30E-31
- FPR2A-0R01F1
- TPS923653DMTR
- 12.87160
- TLVH432BIDBZR
- ACS732KLATR-75AB-T
- RT0603FRE07499RL
- 0541323662
- C3216X5R1H335K160AB
- D2FC-F-7N(100M)
- 7M-25.000MAKV-T
- BM05B-ADHKS-GAN-ETB(HF)
- 猜你喜歡
- XC3S50AN-4TQG144I
- XC3202B183MR-G
- XC3S1400AN-4FGG676C
- XC3SD3400A
- XC3S200AN-4FTG256I
- XC3S250E
- XC3500M-20S
- XC3S200A-4VQG100C
- XC3S200A-4FTG256I
- XC3S400-4TQG144C
- XC3S100E-4TQG144C
- XC3S500E-4FTG256C
- XC3S1400A-4FTG256I
- XC3S1200E-4FTG256C
- XC3S700A-4FGG484I
- XC3S400A-4FGG400C
- XC3S200A-4FTG256C
- XC3S1200E-4FGG400C
- XC3S1500-4FG320I
- XC3S1500-4FG456I
- XC3S1400AN
- XC3042A-7PQ100C
- XC3S700A-4FGG484I5004
- XC3S50A-4TQG144I
- XC3S400AN-4FTG256C
- XC3S1600E-4FGG484I
- XC3S250E-4PQ208C
- XC3S250E-4TQ144C
- XC3S250E-4FT256I
- XC3S250E
- XC3S400-4FGG456C
- XC3S200A-4FG320C
- XC3500P-03S
- XC3S1200E-4FTG256I
- XC3S500E-5PQG208C
- XC3S400-4PQ208C
- XC3SD3400A-4FG676C
- XC3SD3400A
- XC3S1400A-4FG676I
- XC3S1400AN-4FGG676C
- 資訊中心
- onsemi 推出基於第七代 IGBT 的智慧功率模組，以降低加熱和冷卻能耗
- 2024-03-16
- Samtec 開設新台灣設計中心
- 2023-11-13
- TI 利用 SiC 柵極驅動器幫助最大限度地提高電動汽車的行駛里程
- 2023-08-12
- TDK 為 ADAS/AD 電源管理提供極其緊湊和可靠的 CLT 功率電感器
- 2022-08-13
- 意法半導體觸控控制器支持新一代AMOLED節能顯示器
- 2022-07-03
- ADI 公司的無線電池管理系統獲得頂級汽車網絡安全認證
- 2022-04-09
- 通過 Samtec 和 SnapEDA 提供 20 萬多個互連符號和封裝
- 2021-11-13
- TE Connectivity 的新型可插拔連接器滿足了照明應用的市場需求
- 2021-07-04
- 意法半導體的低電容汽車瞬態電壓抑制器為高速接口提供保護
- 2021-05-30
- ROHM新型600V IGBT IPM提供領先的低噪聲，低損耗
- 2021-05-08
- Littelfuse收購Hartland Controls
- 2021-04-05
- Molex推出了汽車主動降噪中的重大傳感器創新，以改善安全性和駕駛體驗
- 2021-02-24
